Electroplated nickel gold is more usually made use of on IC substrates (for instance PBGA), largely for binding gold wires and copper wires; but when electroplating C substrates, further conductive wires need to be built within the gold finger binding area just before electroplating. The metal layers on the multilayer https://trentonzcdee.blogars.com/30543420/aluminum-copper-based-pcb-an-overview